各行业专业述语对行业人士来说非常重要，下面分享一下FPC软板项目名词中英文对照表：
|
工程类别 |
不良名称中文 |
英 文 |
|
目检导线 |
导线 |
Conductors |
|
开路 |
Open |
|
|
短路 |
Short |
|
|
缺口 |
Nicks |
|
|
针孔 |
Pinholes |
|
|
额外铜刺 |
Extraneous Copper Between Conductors |
|
|
毛刺 |
Spurs |
|
|
结瘤 |
Nodules |
|
|
蚀刻凹痕 |
Etched Concave |
|
|
导线分层 |
Conductor Delamination |
|
|
裂纹 |
Cracks |
|
|
导线划痕 |
Scratches on Conductor |
|
|
凹坑 |
Dents |
|
|
变色 |
Discoloration |
|
|
覆盖层和覆盖涂层 |
凹坑 |
Dents on Coverlay and Covercoat |
|
划痕 |
Scratches on Coverlay and Covercoat |
|
|
空洞 |
Void |
|
|
偏位 |
Coverlay Misalign |
|
|
毛刺 |
Coverlay Burrs |
|
|
外来物 |
导电性异物 |
Conductive Foreign Matters |
|
非电性异物 |
Non-conductive Foreign Matters |
|
|
起泡和分层 |
Blistering and Delamination |
|
|
覆盖层粘结剂挤出 |
Squeeze-out of Adhesive of Coverlay |
|
|
覆盖涂层渗出 |
Ooze-out of Covercoat |
|
|
覆盖涂层跳漏 |
Skipping of Convercoat |
|
|
电镀金属或焊锡的表面条件 |
镀金 |
Gold Plating |
|
镀金层缺陷 |
Gold Plating Defects |
|
|
镀锡 |
Tin Plating |
|
|
电镀金属或焊料的渗透 |
Penetration of Plated Metal or Solder |
|
|
变暗（变黑） |
Darkened Appearance (Blackening Discoloration) |
|
|
镀铜孔内镀层空洞 |
Plating Voids in Plated-though Hole |
|
|
增强板 |
FPC与增强板之间的外来物 |
Foreign Matter Between Flexible Printed Board and Stiffener |
|
FPC与增强板之间的空洞 |
Voids Between Flexible Printed Board and Stiffener |
|
|
裂纹 |
Cracks |
|
|
缺角 |
Chip-off |
|
|
划痕 |
Scratches |
|
|
变形 |
Deformation |
|
|
外形和孔边缘 |
撕裂和缺口 |
Tears and Nicks |
|
毛刺 |
Burrs |
|
|
丝状毛刺 |
Thready Burrs |
|
|
弯曲、变形 |
Warpage |
|
|
微连筋不良 |
Poor Micro-joint |
|
|
外形偏移 |
Outline Misalign |
|
|
外形漏冲 |
No Outline |
|
|
反折偏位 |
Bending Line Misalign |
|
|
Surface Condition of Plated Mental and Solder |
镀金粗糙 |
Rough Gold |
|
镀金白雾 |
Gold Discoloration |
|
|
镀金变色 |
Gold Discoloration |
|
|
镀金层龟裂 |
Gold Crack |
|
|
镀金针孔 |
Gold Pinhole |
|
|
电镀露铜 |
Plated Expose Wetting |
|
|
剥离 |
Plated Peeled Off |
|
|
电镀渗入 |
Plated Wicking |
|
|
漏镀 |
No Plating |
|
|
表面伤痕 |
Plating Scratch |
|
|
电镀粗糙 |
Rough Plated |
|
|
药水渗入 |
Wicking |
|
|
表面附着物 |
增强板贴偏移 |
Stiffener Misalign |
|
热固胶 |
Thermosetting Adhesive |
|
|
焊剂残渣 |
Flux Residues |
|
|
金属粉末残渣 |
Residue of Metal Powders |
|
|
粘结剂残渣 |
Residue of Adhesive |
|
|
突起 |
Protrusions |
|
|
凹坑 |
Dents |
|
|
弓曲 |
Bow |
|
|
扭曲 |
Twist |
|
|
定位精度 |
孔的定位精度 |
Positional Accuracy of Holes |
|
孔与焊盘的重合性 |
Registration of Hole to Land |
|
|
覆盖层与焊盘的重合性 |
Registration of Coverlay (or Covercoat) to Land |
|
|
增强板与FPC的重合性 |
孔的重合性 |
Registration of Holes |
|
外形的重合性 |
Registration of Outlines |
|
|
冲外形与导线图形的重合性 |
Registration of Punched Outline to Conductor Patterns |
|
|
压敏胶或热固胶与FPC和增强板的重合性 |
Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener |
|
|
镀通孔的镀铜层厚度 |
Plating Thickness of Copper Panted-through Holes |
|
|
标记 |
尺寸检验 |
Dimensional Inspections |
|
尺寸测量 |
Measurement of Dimensions |
|
|
外部尺寸 |
External Dimensions |
|
|
厚度 |
Thickness |
|
|
孔 |
Holes |
|
|
元件孔 |
Component Holes |
|
|
导通孔 |
Via Holes |
|
|
导通孔偏移 |
Via Hole Misalign |
|
|
安装孔 |
Mounting Holes |
|
|
导线宽度 |
Conductor Widths |
|
|
导线之间的间距 |
Clearances Between Conductors |
|
|
孔中心间距 |
Distance Between Hole Centers |
|
|
板边和导线之间的最小距离 |
Minimum Distance Between Board Edges and Conductors |
|
|
标记错误 |
Wrong Marking |
|
|
字符不清晰 |
Unclear Letter |
|
|
其它 |
短装 |
Shortage |
|
混装 |
Mixed Stowage/Packing |
|
|
离型纸脱落 |
Released Paper Peeled off |
|
|
材料错误 |
Wrong Material |
